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Product DetailSpecification/DimensionsĐặc điểm kỹ thuật / Kích thướcĐặc điểm kỹ thuật / Kích thước
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3.96 mm Pitch, Direct-To-Circuit Board Connector, DF6 Series
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Product DetailProduct Description
Connector compatible with thick wire (AWG#18 - 22) for direct board-to-cable connection with 3.96-mm pitch. By lumping together and making into contacts, solder work is made possible and efficiency is increased.
[Features]
・Work efficiency is increased.
· By making prior thick wires one-by-one into a connector directly attached to the circuit board, lumping them together allows for a product that can be soldered.
· Intended to increase the efficiency of solder work.
· Small.
· Miniaturization is carried out with an eye on thick wires.
· Circuit board mounting height: 7.5mm.
· Width dimension: 5.0 mm.
· Temporary circuit board fastening mechanism.
・Connector can be temporarily affixed to the circuit board in order to make insertion easier.
Basic InformationThông tin cơ bản
| Connector Shape | Rectangular | Connector series initials | D/E/F | D/E/F | DF |
|---|---|---|---|---|---|
| Applicable pin/contact | Male | Number Of Pins | 1 | Connector Type | Cable Connection |
| Rated Current(A) | 5 | Allowable Voltage(V) | 300 | Connection direction | Straight |
| Plating of part touching terminal | No terminal | Product Category | Plug | Specifications | Crimp case |
| Contact Pitch(mm) | 3.96 | Operating Temperature Range(°C) | -35 to +85 | Terminal pitch(mm) | 3.96 |
Please check the type/dimensions/specifications of the part DF6-1P-3.96C in the 3.96 mm Pitch, Direct-To-Circuit Board Connector, DF6 Series series.Vui lòng kiểm tra kiểu/kích thước/thông số kỹ thuật của phần DF6-1P-3.96C trong chuỗi 3.96 mm Pitch, Direct-To-Circuit Board Connector, DF6 Series.
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer toCác thông số kỹ thuật và kích thước của mã sản phẩm có thể không được bao phủ đầy đủ. Để biết chi tiết chính xác, hãy tham khảo manufacturer catalogsdanh mục nhà sản xuất ..
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