MELSEC-F Series Data Link/Communication (RS-422/USB)
:
MITSUBISHI
MELSEC-F Series Data Link/Communication (RS-422/USB)
MELSEC-F Series Data Link/Communication or expansion board equipment offers a wide variety of product type to choose from.
[Features]
• Approved standards: CE (EMC)
• Compliant with the RS485 standard and RS-422 standard
• Ambient Temperature : 0 to 55°C - When Operating, -25 to 75°C
[Application]
MELSEC-F Series Data Link/Communication or expansion board equipment is ideal for a wide range of industrial automation application
RS-485 Communication Function Expansion Board Specifications
FX3G-485-BD external appearance
Specifications
- Approved standards: CE (EMC), ABS, DNV, GL, LR, BV, RINA, NK, KR
- Interface for simple PC-PC link connection (n:n)
- Interface for parallel link connection (1:1)
- Interface for dedicated protocol communication using a computer link where the master is a computer (PC, etc.)
- Interface for 1:1 nonprocedural communication with a measuring instrument or other equipment having an RS-485 interface.
Performance Specifications
| Transmission Standards | Compliant with the RS485 standard and RS-422 standard | |
|---|---|---|
| Isolation Method | No insulation (between the communication line and the CPU) | |
| Transmission Distance | Max. 50 m | |
| External Equipment Connection Method | European Terminal Block | |
| Communication Method | Half Duplex Two-way | |
| Communication Procedure | Nonprocedural, computer link (dedicated protocol type 1, dedicated protocol type 4), parallel link, simple PC-PC link, inverter communication The FX3G supports inverter communication for Ver. 1.10 or later. | |
| Communication Speed | Nonprocedural, Computer Link | 300 / 600 / 1,200 / 2,400 / 4,800 / 9,600 / 19,200 / 38,400 (bps) |
| Parallel Link | 115,200 (bps) | |
| Simple PC-PC Link | 38,400 (bps) | |
| Inverter Communication | 4,800/9,600/19,200/38,400 (bps) | |
| Indicators (LED) | RD, SD | |
| Number Of Occupied Inputs/Outputs | 0 points (This has nothing to do with the maximum number of input/output points of the sequencer.) | |
| Compatible Sequencers | FX3S, FX3G When connecting FX3S, Function Expansion Boards cannot be used with the FX3S-CNV-ADP. | |
General Specifications
| Ambient Temperature | 0 to 55°C - When Operating, -25 to 75°C - When Saving | ||
|---|---|---|---|
| Relative Humidity | 5 to 95% RH (no condensation) - when operating | ||
| Vibration Resistance | When Mounting To DIN Rail | Frequency: 10 To 57 Hz | Single amplitude: 0.035 mm 10 times in each direction of X, Y and Z (total 80 minutes each) |
| Frequency: 57 To 150 Hz | Acceleration: 4.9 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each) | ||
| When Mounting Directly | Frequency: 10 To 57 Hz | Single Amplitude: 0.075 mm 10 times in each direction of X, Y and Z (total 80 minutes each) | |
| Frequency: 57 To 150 Hz | Acceleration: 9.8 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each) | ||
| Impact Resistance | 147 m/s2, for a half-sine pulse three times in each direction of X, Y and Z for a duration of 11 ms | ||
| Noise Resistance | Achieved through a noise simulator with a noise voltage of 1,000 Vp-p, noise width of 1 μs, rise time of 1 ns, and frequency of 30 to 100 Hz | ||
| Withstand Voltage | The communication line is not insulated from the sequencer main body. (Do not perform voltage resistance test) | ||
| Insulation Resistance | The communication line is not insulated from the sequencer main body. (Do not perform insulation resistance test) | ||
| Operating Atmosphere | There shall be no corrosion gas or flammable gas and not much conductive dust. | ||
| Altitude Of Use | 2,000 m or lower Cannot be used in environments pressurized higher than the atmospheric pressure. Doing so may cause failures. | ||
FX3G-485-BD-RJ external appearance
Specifications
- Approved standards: CE (EMC), KC
- Function expansion board for RS-485 communication, equipped with an RJ45 connector.
- Commercially available LAN cables can be used to establish connection.
- Wiring man-hours can be reduced when Mitsubishi inverters, etc., are connected.
Performance Specifications
| Transmission Standards | Compliant with the RS485 standard and RS-422 standard | |
|---|---|---|
| Isolation Method | No insulation (between the communication line and the CPU) | |
| Transmission Distance | Max. 50 m | |
| External Equipment Connection Method | RJ45 Connector | |
| Communication Method | Half Duplex Two-way | |
| Communication Procedure | Nonprocedural, computer link (dedicated protocol type 1, dedicated protocol type 4), parallel link, simple PC-PC link, inverter communication The FX3G supports inverter communication for Ver. 1.10 or later. | |
| Communication Speed | Nonprocedural, Computer Link | 300 / 600 / 1,200 / 2,400 / 4,800 / 9,600 / 19,200 / 38,400 (bps) |
| Parallel Link | 115,200 (bps) | |
| Simple PC-PC Link | 38,400 (bps) | |
| Inverter Communication | 4,800/9,600/19,200/38,400 (bps) | |
| Indicators (LED) | RD, SD | |
| Number Of Occupied Inputs/Outputs | 0 points (This has nothing to do with the maximum number of input/output points of the sequencer.) | |
| Compatible Sequencers | FX3S, FX3G When connecting FX3S, Function Expansion Boards cannot be used with the FX3S-CNV-ADP. | |
General Specifications
| Ambient Temperature | 0 to 55°C - When Operating, -25 to 75°C - When Saving | ||
|---|---|---|---|
| Relative Humidity | 5 to 95% RH (no condensation) - when operating | ||
| Vibration Resistance | When Mounting To DIN Rail | Frequency: 10 To 57 Hz | Single Amplitude: 0.035 mm 10 times in each direction of X, Y and Z (total 80 minutes each) |
| Frequency: 57 To 150 Hz | Acceleration: 4.9 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each) | ||
| When Mounting Directly | Frequency: 10 To 57 Hz | Single Amplitude: 0.075 mm 10 times in each direction of X, Y and Z (total 80 minutes each) | |
| Frequency: 57 To 150 Hz | Acceleration: 9.8 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each) | ||
| Impact Resistance | 147 m/s2, for a half-sine pulse three times in each direction of X, Y and Z for a duration of 11 ms | ||
| Noise Resistance | Achieved through a noise simulator with a noise voltage of 1,000 Vp-p, noise width of 1 μs, rise time of 1 ns, and frequency of 30 to 100 Hz | ||
| Withstand Voltage | The communication line is not insulated from the sequencer main body. (Do not perform voltage resistance test) | ||
| Insulation Resistance | The communication line is not insulated from the sequencer main body. (Do not perform insulation resistance test) | ||
| Operating Atmosphere | There shall be no corrosion gas or flammable gas and not much conductive dust. | ||
| Altitude Of Use | 2,000 m or lower Cannot be used in environments pressurized higher than the atmospheric pressure. Doing so may cause failures. | ||
FX5-422-BD-GOT external appearance
Specifications
- Approved standards: CE (EMC), KC, ABS, DNV, GL, LR, BV, RINA, NK, KR
- Expansion board that connects to the GOT via a MINI-DIN 8‑pin connector to establish RS-422 communication
Performance Specifications
| Transmission Standards | Compliant with the RS-422 standard |
|---|---|
| External Equipment Connection Method | MINI-DIN 8 pin (female) |
| Insulation | No insulation (between the communication line and the CPU) |
| Communication Method | Half Duplex Two-way |
| Communication Speed | 9,600/19,200/38,400/57,600/115,200 (bps) |
| Compatible CPU Units | FX5U CPU unit: Ver. 1.000 onward (from the first unit) |
| Mass | Approx. 20 g |
| Power Supply Specification | |
| Rated Voltage (Internal Power Supply) | 5 V DC |
| Current Consumption (Internal Power Supply) | 20 mA / 5 V DC Power consumption will increase if a GOT 5‑V type is connected. |
* The information provided here does not cover all model numbers.