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Product Detail- CAD Data unavailable Dữ liệu CAD không khả dụng
Cylinder (Tube) Inner Diameter
Stroke
Operating Pressure
Auto Switches
Lead Wire
The number of the switches
Connector type
Type
type
Environment, Applications
Days to Ship
Specification/DimensionsĐặc điểm kỹ thuật / Kích thướcĐặc điểm kỹ thuật / Kích thước
-
Cylinder (Tube) Inner Diameter(Ø)
-
Stroke(mm)
-
Operating Pressure(MPa)
-
Auto Switches
-
Lead Wire
- 0.5
- 1
- 3
- 5
-
The number of the switches
-
Connector type
- M12-4 pin plug connector
-
Type
- Clean Series (relief type)
- Clean Series (vacuum type)
- Copper-free and fluorine-free specification
- Copper/fluorine/silicone-free + low dust generation (relief type)
- Copper/fluorine/silicone-free + low dust generation (vacuum type)
-
type
- 10-CDU
- 11-CDU
- 20-CDU
- 21-CDU
- 22-CDU
-
Environment, Applications
- Non-use of Copper and fluoropolymer-based Material (Partially Plating)
- Clean Room
Days to ShipSố ngày giao hàng
-
- Alltất cả các
- 32 Day(s) or Less
- 37 Day(s) or Less
Specify AlterationsChỉ định thay đổi
Free Mount Cylinder Clean / Low Dust Generation 10-/11-/20-/21-/22-CDU Series (Part Number)
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- ■ For selection / technical information and characteristics on SMC air cylinder products,
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■ Handling SMC Products
Web pages for products currently without individual pages on this site will be released on an ad-hoc basis.
Click here for a quotation or to make an order if you have a model number. - Refer to the manufacturer's catalog for specification and material details.
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Similar Products
Product DetailProduct Description
[10-/11-Series, Clean Series]
・ It is suitable for clean environment.
・ It prevents dust generation in the cleanroom.
[20-Series Copper/Fluorine-Free Specifications]
・ Suitable for use in environments that dislike copper and fluorine materials.
・ External dimensions are the same as standard products.
[21/22-Series, copper / fluorine / silicone-free + low dust generation]
・ It supports environments with restrictions on copper-based, fluorine-based, and silicone-based materials.
・ The structure is the same as the Clean Series (Grease and packaging are different from the Clean Series. )
■ Refer to the table below for details about lead wire / connector specifications.
| Part Number | Price | Minimum Order Qty. | Volume Discount | Days to ShipSố ngày giao hàng | Cylinder (Tube) Inner Diameter (Ø) | Stroke (mm) | Environment, Applications | Operating Temperature (°C) | Operating Pressure (MPa) | Auto Switches | Lead Wire | The number of the switches | Connector type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
- | 1 Piece(s) | Quote | - | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9BW | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9N | 0.5 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9NW | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | F9BW | 0.5 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9BW | 5 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9N | 0.5 | 2 | - | Copper-free and fluorine-free specification | ||
2,059,000 VND | 1 Piece(s) | 32 Day(s) | - | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9NW | 0.5 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 60 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 80 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 90 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 100 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 100 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | 6 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9B | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93 | 0.5 | 1 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9B | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93 | 0.5 | 1 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93V | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9BV | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9BW | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9P | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9BW | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
2,285,000 VND | 1 Piece(s) | 32 Day(s) | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 25 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 25 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
2,398,000 VND | 1 Piece(s) | 32 Day(s) | 25 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) |
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Basic InformationThông tin cơ bản
| Rod Operation Method | Single Rods | Main Body Shape | Plate Cylinder | Cylinder Operation Method | Double Acting |
|---|---|---|---|---|---|
| Additional Function | Standard | End Locking | No | Valves | No |
| Specifications | Built-in magnet |
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer toCác thông số kỹ thuật và kích thước của mã sản phẩm có thể không được bao phủ đầy đủ. Để biết chi tiết chính xác, hãy tham khảo manufacturer catalogsdanh mục nhà sản xuất ..
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